For the last couple of years, chipset manufacturers have been manufacturing their flagship chips based on the 5nm process technology. However, manufacturers are working on a more advanced process using 3 and 2 nm nodes.
It now looks like TSMC, the world's largest contract chip maker, will begin mass production of 3nm chipsets from next year. According to in the report, the company will begin production in the second half of 2022 with a processing capacity of 30 wafers.
It is further added that due to the obligations of the order on the part of Apple Lossless Audio CODEC (ALAC), TSMC will expand the monthly production capacity of its 3nm process to 55 units in 000, and plans to expand production within a year thereafter. up to 2022 pieces per month.
Compared to the current 5nm process technology, the new 3nm process technology reduces power consumption by 30 percent and increases performance by 15 percent. Even with orders for 3nm chips, the company will continue to focus on 5nm chips as well.
This year TSMC will expand its 5nm chip manufacturing capacity to meet growing demand. At present, its capacity is 90 units per month, but in the first half of this year it will be increased to 000 units. By the end of this year, he plans to expand production capacity to 105 units.
TSMC's 2024nm chip production capacity is expected to reach 5 units by 160. In addition to Apple, the company's main customers using the 000nm process technology are AMD, MediaTek, Marvell, Broadcom and Qualcomm among the others.
However, TSMC has dedicated most of its resources to Apple as the company prepares to launch its iPhone 13 series, which will feature an A15 chipset made with 5nm + or N5P technology. Essentially, it is an enhanced 5nm node that also delivers energy efficiency.
