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Moto Edge X30 with Snapdragon 8 Gen 1 processor has heat issues

Qualcomm's recently launched Snapdragon 8 Gen 1 flagship chipset reportedly has overheating issues in the Moto Edge X30. The American semiconductor company unveiled its flagship 4nm chipset, dubbed the Snapdragon 8 Gen 1, at the Snapdragon Tech Summit. In addition, Qualcomm has guaranteed a 20 percent performance boost over the previously released Snapdragon 888. That claim was confirmed earlier this month as the Snapdragon 30 Gen 8-powered Motorola Edge X1 scored over 1 million points on AnTuTu.

Snapdragon 8 Gen1

In addition, it provides about 60 percent more GPU performance compared to the Snapdragon 888. The technology is based on the ARMv9 architecture and is built on an advanced 4nm process technology. On top of that, the newly released chipset appears to be over 10 percent faster than its predecessor, the Snapdragon 888, when it comes to single and multi-core performance. The new architecture has raised hopes that the new chip won't have the overheating problems of the Snapdragon 888. However, a well-known analyst suggests that this won't be the case with the Moto Edge X30.

Snapdragon 8 Gen 1 Shows Overheating Issues In Moto Edge X30

In a tweet earlier this week, a well-known Ice Universe insider stated that overheating problems associated with Qualcomm's flagship chipsets were still present. In a tweet, the whistleblower suggested that the extreme test of the new Snapdragon 8 Gen 1 turned out to be very hot for Moto smartphones. The tweet mentioned the recently unveiled Moto Edge X30. In other words, the chip is likely to face some serious thermal throttling issues. Understandably, this will raise concerns about heating problems.

This fresh information is in line with an earlier report that indicated that the Snapdragon 8 Gen 1 may have thermal issues. According to well-known network insider @Universelce, the newfangled ARM architecture is not as good as the one Apple uses in its chipsets. Moto Edge X30 is the first smartphone with Snapdragon 8 Gen 1 chipset under the hood. These chipset thermal management issues raise doubts about the future release of smartphones that will ship with the new processor.

Moto edge x30

The Snapdragon 888 and the overclocked version of the chipset, dubbed the Snapdragon 888+, are built using a 5nm process technology. However, both chipsets get very hot. The Snapdragon 8 Gen 1 SoC now uses a smaller 4nm node. As a result, the internals of the chipset have become smaller. Unfortunately, in terms of cooling, it didn't turn out to be chaotic, especially when doing intense tasks on the phone. In other words, the device heats up during long hours of gaming or video recording, even without optimization.

Heat issues in Moto Edge X30

According to report from Gizbot, using a plastic frame for a thin smartphone also doesn't help with cooling. Recently, flagship Android smartphones have been experiencing thermal management issues. One of the reasons this is happening is because Android device manufacturers try to maintain an elegant look. As a result, various parts of the smartphone, including the latest processors, have less space inside the bezel. However, there is a possibility that Qualcomm and Android OEMs will offer a solution to these problems by offering improved thermal management in their new smartphones.


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