TSMC (Inkampani yase-Taiwan semiconductor) inamathela kubuchwepheshe bayo benqubo ye-3nm. Le nkampani iqhubeka ngokulandela uhlelo lwayo lwentuthuko futhi ihlela ukuqala isigaba sokukhiqiza esiyingozi kulo nyaka.
Ngesikhathi kufonelwa ucingo ekuqaleni kwaleli sonto, umphathi we-chip giant u-CC Wei uthe, “Kuthuthuka ngokugcwele ubuchwepheshe bethu be-N3. Sibona ukubandakanyeka kwamakhasimende okuphezulu kakhulu kwezinhlelo zokusebenza ze-HPC ne-smartphone ku-N3 uma kuqhathaniswa no-N5 no-N7 esigabeni esifanayo. ” Ngaphezu kwalokho, inkampani ihlose ukwethula ukukhiqizwa ngobuningi ngengxenye yesibili ka-2022, ngomkhiqizo oyingozi oqala engxenyeni yesibili yalo nyaka.
Ngokwalo mbiko DigiTimesI-TSMC iphinde yahlela ukusetshenziswa kwemali ebhekiswe kuyo engu- $ 25 billion kuya ku- US $ 28 billion, ephakeme kunakuqala eyayingalinganiselwa ku- $ 20 billion kuya ku- $ 22 billion. Isizathu sokwenyuka kwamanje asikaziwa njengoba umphathi wenkampani eyeke ukuphawula ngama-oda athile namakhasimende lapho ebuzwa ngokuthola isicelo sokukhishwa ku-Intel. Kodwa-ke, u-Wei wengeze ukuthi izindleko zemali ye-TSMC ziphakeme ngenxa yobunzima bezobuchwepheshe.
Ngokusho kwabaphathi abaphezulu, i-EUV lithography nentuthuko yayo kwezobuchwepheshe yimbangela enkulu yokwenyuka kwemali esetshenzisiwe kulo nyaka. Ngaphezu kwalokho, i-TSMC ikholelwa ukuthi izindleko zamandla aphezulu zizosekela nokukhula kwesikhathi esizayo. Ngokunjalo, umenzi wezinkontileka omkhulu kunabo bonke emhlabeni uphinde wakhulisa umgomo wakhe we-CAGR wemali engena emaphesentini ayi-10-15 ngama-dollar ngama-2025.
I-TSMC iphinde yamemezela ukuthi isebenza kubuchwepheshe be-3D SoIC (System on Integrated Circuits) obuzolungela ukukhiqizwa ngo-2022. Le nkampani ilindele ukuthi imali engenayo yezinsizakalo zayo ikhule naseminyakeni embalwa ezayo. iminyaka, ikakhulukazi nomndeni we-3DFabric wezobuchwepheshe obukhuthazayo. UWei uqhubeke wathi, “Sibona ama-chiplets eba yimboni. Sisebenzisana namakhasimende amaningi ku-3DFabric ukusebenzisa ukwakhiwa kwe-chiplet. "
