IPhini likaSihlalo we-Samsung Hardware Solutions Division, uJin Jinan, uthe namuhla inkampani izoqedela ukutshalwa kwezimali embonini yase-US "ASAP" ... UJin Jinan uthe, "Kuzothatha isikhathi ukwenza ukuhlaziya okuphelele kwazo zonke izici ezifana nengqalasizinda, izindawo, abasebenzi kanye nezinzuzo zendawo, bese uthatha isinqumo esingujuqu." Okwamanje, i-Samsung ayinalo usuku oluqondile lokuqedwa kwalesi sitshalo.
Kubikwa ukuthi uJin Jinan unikeze impendulo eshiwo ngenhla embuzweni othi "Ingabe abakwaSamsung Electronics bazotshala imali kulo nyaka" ngesikhathi ehambele uMbukiso Wezobuchwepheshe waseKorea wango-2021. Akazange achaze kabanzi ngohlelo oluthile, kodwa uthe inkampani "yenza yonke imizamo yokuthatha isinqumo ngokushesha okukhulu."
UJin Jinan naye ukushilo lokho AbakwaSamsung Electronics “ngokuzolile” balungiselela ukuphendula uphenyo lwakamuva loMnyango Wezohwebo wase-US mayelana nebhizinisi labo le-semiconductor ... Ngokwemibiko yangaphambilini evela kwabezindaba baseKorea, u-Lee Jae Young wakwaSamsung uzohambela e-US ngenyanga ezayo. Inhloso yohambo lwakhe ukwenza isinqumo sokugcina ngendawo yesikhungo sesibili se-wafer sakwaSamsung Electronics.
Lo Meyi AbakwaSamsung Electronics bamemezele ukuthi batshala imali eyizigidi eziyizinkulungwane eziyi-17 ukwakha umugqa wesibili wokukhiqiza e-United States. Kodwa-ke, inkampani ayikasitholi lesi sitshalo.
I-TSMC ne-Intel bazophinde bakhe isitshalo e-US
NgoMeyi ngonyaka odlule, i-TSMC yamemezela inhloso yayo yokwakha imboni e-United States. I-chipmaker yaseTaiwan isiqinisekisile ukuthi lesi sitshalo sizotholakala e-Arizona. Isimemezelo se-TSMC ngonyaka odlule siphinde siveze ukuthi imboni yayo ye-chip yase-Arizona izoqala ukukhiqizwa ngo-2024. Lapho kuqedwa, umthamo wokukhiqiza wanyanga zonke ohleliwe uzoba ama-wafers angu-20. I-TSMC ihlela ukutshala imali eyizigidi eziyizinkulungwane eziyi-000 kulesi sitshalo kusuka ngo-12 kuya ku-2021.
Ngaphezu kwalokho, i-Intel imemezele ukutshalwa kwezimali kuka-$ 20 billion ngoMashi kulo nyaka. Inkampani izosebenzisa lesi sikhwama ukwakha izitshalo ezimbili eziyisicwecwana e-Arizona, e-USA, futhi ivule kabusha isizinda.
I-USA - inkundla entsha yempi yabenzi bama-chip
I-TSMC, Samsung futhi i-Intel ilungiselela ukuvula imboni entsha e-United States, futhi lelo zwe kancane kancane liba inkundla yempi yabakhi bamashipa. I-TSMC kubikwa ukuthi izokwakha izimboni eziyisithupha ze-5nm chip e-Arizona. Ngaphandle kwalokho, AbakwaSamsung bahlela nokutshala imali ekukhiqizeni Ama-chips we-3nm eTexas, eU.SA. Ngaphezu kwalokho, i-Intel iphinde yamemezela ukuthi izotshala imali engu-$ 20 billion ekwakheni izimboni ezimbili ze-semiconductor wafer e-Arizona, e-USA. Uma le mibiko yenzeka, i-US izoba inkundla entsha yempi yabadlali abakhulu embonini yama-chip.
