I-Samsung yenye yeenkampani ezimbalwa zee-smartphone ezenza ii-chipsets zayo, kwaye ngoku isigebenga saseMzantsi Korea siceba ukuba yinkampani ehamba phambili ye-semiconductor emhlabeni ngo-2030.
Ngokuhambelana nale njongo, inkampani ibhengeze ukuqala kolwakhiwo lomzi mveliso omtsha we-chipset ePyeongtaek, eMzantsi Korea, oza kugxila kwii-chipsets ze-5nm ze-Samsung.
Umsebenzi omtsha uya kuba noxanduva lokudala AI inikwe amandla (ubukrelekrele bokuzenzela), ii-smartphones eziphezulu kunye ne-HPC (ukusebenza okuphezulu kwekhompyuter) iichips. Inkampani sele iqalile umsebenzi wokwakha, ekulindeleke ukuba ugqitywe kunyaka ozayo.
Ngotyalomali olucwangcisiweyo lokujikeleza i-10 trillion ephumeleleyo (i-US $ 8,1 yezigidigidi), i-Samsung iceba ukuqala imveliso kweli ziko litsha kwisiqingatha sesibini sonyaka olandelayo, esi sisiqingatha sesibini se-2021. Imveliso entsha ithetha ukuba i-Samsung ngoku inezixhobo ezintathu ezinjalo. Kwiphondo laseGyeonggi eMzantsi Korea, nganye ePyeongtaek, Hwasong naseYunin.
Isamsung ilandela i-TSMC, okwangoku ekhokela ikhontrakthi yomenzi wekhontrakthi, ngokufumana i-54% yentengiso. I-TSMC sele iqalile ukuvelisa ngobuninzi bee-5nm chips kwaye ngoku ivelisa i-chipset ye-Apple A14.
Uphuhliso lweSamsung luza kwiintsuku ezimbalwa emva koko TSMC ibhengeze umgca wayo omtsha wemveliso ye-5nm eArizona, eMelika. Inkampani kulindeleke ukuba ichithe malunga ne-12 yezigidigidi zeedola phakathi kowama-2021 nowama-2029 kulwakhiwo, nolwakhiwo lucwangciselwe ukuqala kunyaka olandelayo.
Isigebenga saseTshayina uHuawei ikwangomnye wabavelisi abaphambili beetshipsi, kodwa kufuneka sibone ukuba ikamva liphethe ntoni kwinkampani, ngenxa yokuba i-TSMC iyekile ukwamkela ii-odolo ezintsha ezivela eHuawei emva kokuba urhulumente wase-US etshintshe imigaqo apho iinkampani zisebenzisa nayiphi na i-American design okanye itekhnoloji, Imvume ekhethekileyo yokwenza ishishini neHuawei. Esi sisibetho esikhulu kwiTSMC, njengoko uHuawei wayengumthengi wesibini ngobukhulu emva koko iapile.
