Kwiminyaka ethile edlulileyo MediaTek ubambekile kwi-limbo, ungenanto yakwenza neQualcomm kunye neechipsets zayo. Iichips zenkampani zinokufumaneka kuphela kwii-smartphones ezivela kwiimpawu ezincinci zaseTshayina. Emva kwemizamo engaphumelelanga yokungena kwimarike yeflegi, njenge-Helio X10 okanye i-X30 chips, ezazama ukuzenzela igama nge-deca-core architecture, uphawu lwagqiba ekubeni luhlolisise izicwangciso zalo. Ngo-2019, sabona ukubuya kophawu kunye ne-Helio G90T SoC. Yayiyi-chipset elungileyo kakhulu kwicandelo loluhlu oluphakathi. Nangona kunjalo, uhlengahlengiso olukhulu lweza ngo-2020 xa uphawu lwazisa i-5G Dimensity lineup ye-chipsets. Kunyaka ozayo, uphawu lulungiselela ukubuya kwalo lokwenyani kwicandelo leflegi kunye neDimensity 2000 SoC. Nangona kunjalo, i-tipster ibanga ukuba eli ayilogama lokwenyani le-SoC ezayo.
I-Dimensity 2000 ayilogama lokwenyani le-MediaTek's flagship SoC
I-MediaTek izuze ukuthandwa okuninzi ngomgca wayo weDimensity. Ngapha koko, ngelixa i-Qualcomm ithengisa iitshiphusi zayo ze-5G njengento yecandelo "leprimiyamu", iMediaTek ikwazile ukubonelela ngomgangatho ophakathi kunye neetshiphusi ezisezantsi ze-5G. Kulo nyaka, uphawu lunyuse umdlalo walo ngeDimensity 1200 kunye ne-DIme density 1100 SoCs. Iichips zenziwe kwi-6 nm architecture, elinyathelo elinye emva kweQualcomm, i-Samsung kunye ne-Apple. Ngaphandle koku, i-chip ifumene ukuqondwa kwiimpawu ezininzi eziye zayisebenzisa kwii-smartphones zabo ezibulala iiflegi kunye nee-smartphones ezikumgangatho ophakathi. Ngeli xesha, ukufumaneka kweetshiphusi ze-5G eziphakathi kunye nezisezantsi kuqhubekile nokunyuka. Namhlanje iMediaTek ngoyena mvelisi mkhulu we-chipset onesabelo esikhulu semarike. Egcwele ukuzithemba, umenzi we-semiconductor waseTaiwan ulungele ukukhuphisana kwicandelo leflegi.
I-chipset yesizukulwana esilandelayo iya kugxila kwi-architecture ye-4nm kwaye iya kubandakanya i-ARM Cortex-X2 cores, i-A710 cores, kunye ne-A510 cores. Olu lungelelwaniso luyafana neminikelo evela kwi-Samsung kunye ne-Qualcomm. Umahluko omkhulu kukuba iMediaTek iya kuxhomekeka kwinkqubo yokuvelisa ye-TSMC ye-4nm.
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I-MediaTek Dimensity 9000 yiflegi entsha ye-SoC evela kwiMediaTek
Namhlanje, umhlalutyi othembekileyo we-Ice Universe kutyhilwe nge-tweet ukuba i-chip ye-MediaTek elandelayo-gen iya kwaziwa ngokuba yi-Dimensity 9000 kunokuba i-Dimensity 2000. Okubangela umdla kukuba, oku kuza ngexesha elifanayo ukuba i-Qualcomm elandelayo-gen chip iza kuzisa igama elahlukileyo. Endaweni ye-Snapdragon 898, inokubizwa ngokuba yi-Snapdragon 8 Gen1 (ewe, elo gama liyanya). Ngenxa yodumo oluhle lwe-Ice Universe, sinesizathu esivakalayo sokukholelwa amabango ayo. Ngaphezu koko, kunengqiqo, ngakumbi xa i-Dimensity 1200 ingekho i-chipset ekhuphisana ne-SD888 okanye i-Exynos 2100. I-MediaTek ifuna ukuqiniseka ukuba i-chip yayo ezayo ivakalelwa ngathi iphucula kakhulu kwi-Dimensity 1200.
Snapdragon 898ㄨ
I-Snapdragon 8 gen1 ✓ (le yingqiqo yokubiza amagama, kodwa hayi inguqulelo yokugqibela)
Ubungakanani 2000ㄨ
Ubungakanani 9000 ✓
Exynos:" Damn? Akufuneki ndiyitshintshe loo nto, akunjalo? »-Umhlaba wendalo (@UniverseIce) I-15 kaNovemba iminyaka ye-2021
Ukusebenzisa igama elahlukileyo kwi-SoC yayo yeflegi ikwavumela iMediaTek ukuba igcine i-DIme density 2000 ithiya into engaphaya kweDimensity 1200 SoC. Ixesha liya kubonakala.
Ngelixa zontathu ii-2022 ze-flagship ze-SoCs ziya kusebenzisa ulwakhiwo olufanayo, umahluko unokulala kuqwalaselo lwe-GPU. I-Samsung iza kusebenzisa i-AMD yeselula ye-GPU, i-Qualcomm iya kusebenzisa i-Adreno 730. I-MediaTek ihlebezwa ukuba isebenzise iMali G710 MC10. Ngokutsho kwamahemuhemu, le GPU iya kuphulukana nabakhuphisana nayo. Nangona kunjalo, kusetyenziso lokwenyani kuphela oluya kuxela ukuba kukho umahluko phakathi kwe-trio ye-Flegship SoCs. Inyani ayinamsebenzi, iibrendi ezininzi ziya kusebenzisa iMediaTek Dimensity 9000 SoC kulo nyaka uzayo, eya kwandisa ngakumbi ubukho benkampani kwimarike ye-smartphone.
