moetsi oa li-chip oa Taiwan, MediaTek e na le li-processor tse 'maloa tse tla hlaha ho li-smartphones tse holimo le tse bohareng ka 2022. Ho latela @DCS, lichifi tsa MediaTek Dimensity 8000 li tla romelloa ka li-batches ho tloha ka Hlakubele. Lihlahisoa tsa China tse kang Redmi, Realme le tse ling ho tlalehoa li tla sebelisa processor ea Dimensity 8000.
Dimensity 8000 e sebelisa ts'ebetso ea tlhahiso ea TSMC ea 5nm le meaho e habeli ea 4+ 4. Chip ena e na le li-cores tse 4 tse kholo tsa Cortex A78 le li-cores tse 4 tse nyane tsa Cortex A55. Maqhubu a CPU a fihla ho 2,75 GHz 'me GPU ke Mali-G510 MC6. Chip ena e tšehetsa qeto ea 2K 120Hz kapa 1080P 168Hz hammoho le LPDDR5 + UFS 3.1 motsoako oa polokelo.
Ho latela blogger e tsebahalang ea theknoloji Weibo @Lebohang , mohlala oa boenjiniere oa smartphone e sebelisang chip ena e se e fumaneha. Likhetho tse khethehileng li kenyelletsa skrine ea 6,6-inch FHD+, 120Hz e phahameng ea ho khatholla, le 12GB ea RAM. Sesebelisoa se boetse se tla le kh'amera e ka pele ea 16MP hammoho le kh'amera e ka morao ea 50MP + 50MP + 2MP tse tharo tse ka morao. Ho latela @DCS, smartphone ena e tla hlahisoa ka molao kamora Mokete oa Selemo mme e tla rekoa ka li-Yuan tse 2000 ($ 314). Leha ho le joalo, ha aa ka a senola lebitso la brand.
Habohlokoa le ho feta, MediaTek Dimensity 8000 e fumane 750 ho AnTuTu. E otla Snapdragon 000, e nang le kakaretso ea AnTuTu e ka bang 870. Ke habohlokoa ho hlokomela hore Redmi, Realme le lihlahisoa tse ling li netefalitse ka molao hore li tla lokolla li-smartphone ka chip ena.
MediaTek e ntse e tsoela pele ho etella pele 'maraka oa li-smartphone chip
Counterpoint Research e phatlalalitse tlaleho mabapi le thomello ea li-chipsets tsa li-smartphones karolong ea boraro. Lintlha li bonts'itse hore MediaTek e atolositse ketapele ea eona ho Qualcomm, e tiisa boemo ba eona ba pele 'marakeng. Unisoc e boetse e entse tsela e itseng, e fetang Samsung; boemong ba bone 'marakeng oa li-smartphone SoC.
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MediaTek e atlehile ho matlafatsa boemo ba eona haholo-holo ka lebaka la tlhokahalo e phahameng ea li-chips tsa 4G. Qualcomm e ntse e tsoela pele ho etella pele 'maraka oa 5G smartphone chipset, e romella 62% ea li-chipsets tsa eona tsa cellular tsa 5G. Apple e ile ea khona ho boloka sebaka sa eona sa boraro har'a bafani ba li-mobile chip, ha Samsung e tloha sebakeng sa bone ho ea ho sa bohlano; e lahlehetsoe ke boemo ba eona ho Unisok. Khampani e ile ea khona ho atleha ka ho haha litšebelisano; e nang le lihlahisoa tse kang Realme, Motorola, ZTE, Samsung le Honor.
Kabelo ea HiSilicon e theohile haholo ho tloha ho 13% kotareng ea boraro ea selemo se fetileng ho ea ho 2% selemong sena. Ha ho pelaelo hore ho fokotseha ho bakoa ke likotlo tsa US khahlanong le Huawei; e leng se entseng hore ho be thata hore HiSilicon e ka tlase ho eona e hlahise lichifi tse tsoetseng pele.
Ka ho lokolloa ha li-processor tsa Snapdragon 8 Gen1, Dimensity 9000 le li-chips tse ling, ho tla ba le tlhōlisano 'marakeng.
