MediaTek le Qualcomm ke bahanyetsi tšimong ea li-processor tsa smartphone. Qualcomm esale e le "morena" 'marakeng oa li-flagship processor. Le ha MediaTek e sebetsa hantle mebarakeng ea mahareng le ea maemo a holimo, ha e bonahale ka ho khetheha 'marakeng oa li-flagship. Leha ho le joalo, limmaraka tsa bohareng ho isa boemong ba ho kena li lekane ho etsa MediaTek moetsi oa li-chip o moholo ka ho fetisisa lefatšeng. Li-processor tsa li-smartphone li ntse li e-ba matla le theknoloji e ntse e ntlafala. Leha ho le joalo, phihlelo ha ea tlameha ho ba e ntle.
Selemong sena re bile le bothata ba ho futhumatsa ka li-smartphones tsa li-flagship. Sena se bonahala haholoanyane ho li-smartphones tse nang le li-processor tsa Qualcomm Snapdragon 888 le 888+. Tabeng ena, MediaTek, e sa tsoa lokolla Dimensity 9000, e itšepa haholo. Khamphani e re ho na le k'hamphani e le 'ngoe feela lefatšeng e nang le bothata ba mocheso oa chip, empa seo ha se MediaTek. Kaofela rea tseba hore moetsi oa Taiwan o ntse a otla ka mokhoa o poteletseng ho Qualcomm.
MediaTek e bontša kholiseho e kholo ts'ebetsong ea Dimensity 9000. Ho ea ka k'hamphani, mehlala eohle eo e e rometseng ho bahlahisi e khutlile ka maikutlo a matle haholo. Sena se bolela hore lik'hamphani tse ngata li tla fetohela ho processor ea maemo a holimo ea Dimensity 9000.
Samsung e tla sebelisa MediaTek Dimensity 9000
Samsung e tla leka processor ea li-flagship ho latela tlaleho ea Sammobile MediaTek Boima 9000. @UniverseIce e re Samsung ke e 'ngoe ea lik'hamphani tse ngata tse lekang mochine oa khatiso oa Dimensity 9000. Haeba moetsi oa Korea Boroa a nka hore ts'ebetso le matla a matla a lekaneng, o tla sebelisa chip ho smartphone kapa tablet ea eona ea Galaxy.
Ho se ho ntse ho e-na le tiiso ea hore Samsung Galaxy S22 e tla sebelisa Snapdragon 8 Gen1 le Exynos 2200. Kahoo Samsung e ka sebelisa Dimensity 9000 ka lisebelisoa tse phahameng ka halofo ea bobeli ea selemo. Dimensity 9000 e kanna ea se ke ea hlaha letotong la Galaxy S22. Leha ho le joalo, mohlomong re tla bona chip ena ho lisebelisoa tse ling tsa li-flagship, haholo-holo matlapeng.
Samsung e khahloa ke ts'ebetso e phahameng ea taolo ea matla ea MediaTek Dimensity 9000. Chip ena e sebelisa ts'ebetso ea tlhahiso ea TSMC ea 4nm, e leng betere ho feta ts'ebetso ea tlhahiso ea Samsung ea 4nm EUV. Ts'ebetso ea taolo ea matla ea li-processor tsa li-flagship tsa Snapdragon esale e le mpe. Snapdragon 888 ke pherekano e felletseng ha ho tluoa taolong ea matla. Ho ka etsahala hore ebe Dimensity 9000 e tla feta Snapdragon 8 Gen1 ho latela taolo ea matla.
Samsung hajoale ke eona feela moetsi oa mehala ea selefouno e sebelisang li-processor tse tharo tsa maemo a holimo. Khamphani e kanna ea sebelisa Samsung Exynos 2200, Qualcomm Snapdragon 8 Gen1 le MediaTek Dimensity 9000. Baetsi ba bangata ba tla sebelisa Snapdragon 8 Gen1 le MediaTek Dimensity 9000. Li-chips tsa Samsung tsa Exynos Flagship li sebelisoa haholo-holo letotong la tsona la Galaxy S.
