Zaka zingapo zapitazo MediaTek takhala mu limbo ndi zochepa kapena palibe chochita ndi Qualcomm ndi chipsets zake. Tchipisi za kampaniyo zitha kupezeka pa mafoni a m'manja kuchokera kumitundu yaying'ono yaku China. Atalephera kulowa mumsika wodziwika bwino, monga Helio X10 kapena X30 chips omwe adayesa kudzipangira dzina ndi zomangamanga za deca-core, mtunduwo unaganiza zoganiziranso njira zake. Mu 2019, tidawona mtunduwo ukubwerera ndi SoC Helio G90T. Inali chipset yabwino kwambiri yapakatikati. Komabe, kukonzanso kwakukulu kudabwera mu 2020 pomwe mtunduwo udavumbulutsa mzere wa 5G Dimensity wa chipsets. Mtunduwu ukukonzekera kubwereranso kugawo lodziwika bwino chaka chamawa ndi Dimensity 2000 SoC. Komabe, tipster akuti ili si dzina lenileni la flagship SoC yomwe ikubwera.
Dimensity 2000 si dzina lenileni la MediaTek's flagship SoC
MediaTek yapeza kutchuka kwambiri ndi mzere wake wa Dimensity. Kupatula apo, pomwe Qualcomm imagulitsa tchipisi ta 5G ngati gawo la "premium", MediaTek yakwanitsa kupereka tchipisi tapakati mpaka 5G. Mtunduwu udakulitsa masewera ake chaka chino ndi Dimensity 1200 ndi DIme density 1100 SoCs. Ma chips adapangidwa pamapangidwe a 6nm, omwe ndi sitepe imodzi kumbuyo kwa Qualcomm, Samsung ndi Apple. Mosasamala kanthu, chipchi chapambana kutamandidwa ndi mitundu yambiri yomwe adagwiritsa ntchito m'ma foni awo opha anthu komanso mafoni apamwamba apakati. Pakadali pano, kupezeka kwa tchipisi tapakati komanso otsika a 5G kunapitilira kukwera. Masiku ano MediaTek ndiye opanga ma chipset akulu kwambiri omwe ali ndi gawo lalikulu pamsika. Pokhala ndi chidaliro, wopanga semiconductor waku Taiwan ndi wokonzeka kupikisana nawo pagulu.
Chipset ya m'badwo wotsatira idzayang'ana zomanga za 4nm ndipo iziphatikiza ma ARM Cortex-X2 cores, A710 cores, ndi A510 cores. Kukonzekera uku ndikofanana ndi zopereka zochokera ku Samsung ndi Qualcomm. Kusiyana kwakukulu ndikuti MediaTek idalira njira yopangira TSMC ya 4nm.
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MediaTek Dimensity 9000 ndi MediaTek's flagship SoC yatsopano
Lero ndi katswiri wodalirika ku Ice Universe kuvumbuluka kudzera pa tweet yomwe MediaTek's generation generation chip idzadziwika kuti Dimensity 9000 osati Dimensity 2000. Chochititsa chidwi n'chakuti, izi zikuchitika panthawi yomweyi - Qualcomm - generation chip idzabweretsa dzina losiyana. M'malo mwa Snapdragon 898, ikhoza kutchedwa Snapdragon 8 Gen1 (inde, dzinalo limayamwa). Popeza kuti Ice Universe ili ndi mbiri yabwino, tili ndi zifukwa zomveka zokhulupirira zonena zake. Komanso, zimakhala zomveka, makamaka pamene Dimensity 1200 si chipset chomwe chimapikisana ndi SD888 kapena Exynos 2100. MediaTek ikufuna kuonetsetsa kuti chipangizo chake chamtsogolo chikuwoneka ngati kukweza kwakukulu pa Dimensity 1200.
Snapdragon 898ㄨ
Snapdragon 8 gen1 ✓ (awa ndiye malingaliro amatchulidwe, koma osati mtundu womaliza)
Dimensity 2000ㄨ
Kukula 9000 ✓
Exynos: "Amayi? Sindiyenera kusintha izi, sichoncho? "- Ice chilengedwe (@UniverseIce) 15 November 2021 zaka
Kugwiritsa ntchito dzina losiyana ndi mbiri yake ya SoC kumathandizanso MediaTek kusunga DIme density 2000 kutchula chilichonse kupitilira Dimensity 1200 SoC. Nthawi idzawoneka.
Ngakhale ma SoCs atatu otsogola kuchokera ku 2022 adzagwiritsa ntchito zomanga zofanana, kusiyana kutha kukhala mu kasinthidwe ka GPU. Samsung idzagwiritsa ntchito GPU yam'manja ya AMD, Qualcomm idzagwiritsa ntchito Adreno 730. MediaTek ikunenedwa kuti ikugwiritsa ntchito Mali G710 MC10. Malinga ndi mphekesera, GPU iyi idzataya omwe akupikisana nawo. Komabe, kugwiritsa ntchito kwenikweni kokha kudzawonetsa ngati pali kusiyana pakati pa atatu amtundu wa SoCs. Zowona zilibe kanthu, mitundu yambiri idzagwiritsa ntchito MediaTek Dimensity 9000 SoC chaka chamawa, ndikukulitsa kupezeka kwa kampaniyo pamsika wa smartphone.
