Kamoso Qualcomm e tla hlahisa chip ea liphatlalatso Snapdragon 8 Gen 1. Ho lokolloa ho ke ke ha etsahala hore ho be le ho phatloha, empa ba bangata ba tla thahasella ho bona mohanyetsi oa sethaleng sena - MediaTek Dimensity 9000. Ho sa tsotellehe hore li-chips li hlahisoa ke lik'hamphani tse sa tšoaneng, li-processors. e lokela ho tšoana haholo ka tshebetso. ... Ho se ho bile le likhakanyo tsa hore ho ke ke ha e-ba le phapang ea matla pakeng tsa bona.
Empa setsi sa marang-rang se tsebahalang sa Digital Chat Station se ka soabisa ba bechang MediaTek mme e ne e dumela hore Dimensity 9000 le Dimensity 7000 tsa yona di ka beha Qualcomm kotsing. Ho ea ka eena, hona joale Xiaomi e ntse e leka lisebelisoa tse peli tse nang le Dimensity 9000 le Snapdragon 8 Gen 1. Kamoo ho bonahalang kateng, re bua ka Redmi K50 le Redmi K50 Pro.
Empa, oho, ha ho na tekano ka lebelo la mosebetsi pakeng tsa bona. Sesebelisoa se nang le processor ea boemo bo holimo ho tsoa Qualcomm se sebetsa hantle ho feta sesebelisoa se nang le chipset e ncha e tsoang ho MediaTek. Boemo bo ts'oanang, ho ea ka motho ea ka hare, bo etsahala ka khohlano pakeng tsa Dimensity 7000 le phetolelo e ncha ea Snapdragon 870. 'Me sena se fanoa hore lisebelisoa tsohle tse lekiloeng li tsamaisa MIUI 13.
Ka nako e ts'oanang, Digital Chat Station e tiisa hore Dimensity 7000 e ntle haholo. Ho ea ka eena, chip e sebelisa theknoloji ea TSMC 5-nanometer mme e fumane li-cores tsa Cortex-A78 tse sebetsang hantle. E sebetsa hantle ka lipontšo tsa 120Hz QuadHD + le lipontšo tsa 168Hz FullHD +. E tla boela e u lumelle ho kenya LPDDR5 RAM le polokelo ea UFS 3.1.
Mehala ea mehala ea MediaTek
Mehala ea mehala ea MediaTek li sebelisoa mefuteng e mengata ea li-smartphone tsa Android, empa le lihlahisoa tse ncha tse ntle ka ho fetisisa tsa k'hamphani ha ho mohla li kileng tsa khona ho qothisana lehlokoa le mefuta e fapaneng ea Qualcomm's Snapdragon. Leha ho le joalo, ho fihla ha chipset ea Dimensity 9000 ho ka fetola melao ea papali.
Bekeng e fetileng, k'hamphani e ile ea senola sethala sa mobile sa Dimensity 9000, chip e matla ka ho fetisisa ea k'hamphani. Ho ea ka likhakanyo tsa selelekela, e ka ba 35% e behang ho feta letšoao la Snapdragon 888; Ts'ebetso ea GPU le eona e potlakile ka 35%.
The processor ke microcircuit e entsoeng ho latela theknoloji ea -nm process; mme e sebedisa konokono e le nngwe Cortex-X2 ho 3,05 GHz, tse tharo tsa Cortex-A710 ho 2,85 GHz le tse nne tsa Cortex-A510 ho 1,8 GHz. E sebelisa Mali-G710 GPU hammoho le APU ea mantlha e tšeletseng (e sebelisoang ho sebetsana le li-algorithms tsa AI).
The Image Processor (ISP) ke 18-bit ISP Imagiq e khonang ho nka linepe ho fihlela ho 320 megapixels; le phetiso ea data ka lebelo ho fihla ho li-gigapixel tse 9 motsotsoana. Modem e hahelletsoeng ha e tšehetse maemo a 5G mmWave; empa e khona ho sebetsa ho marang-rang ho fihla ho 6 GHz. E tšehetsa Bluetooth 5.3 le Wi-Fi 6E.
Ho ea ka MediaTek , tekong ea Geekbench multi-core test, Dimensity 9000 chipset e batla e lekana le ts'ebetso ea Apple A15, e sebelisoang ho li-smartphone tsa morao-rao tsa letoto la iPhone 13, 'me e fumana lintlha tse ka bang 4000. Ka nako e ts'oanang, MediaTek ha e senole li-benchmarks tse ling khahlano le lihlahisoa tsa Apple; eo hangata e sieang bahlodisani morao haholo.
